SED-100RJ1-C — SED-100RJ1-C Fully-Automatic Softgel Encapsulation Machine
لا تزال ترجمة الوصف الكامل لهذا الطراز قيد العمل. راجع التفاصيل بالإنجليزية أو اطلب المعلومات من فريقنا. English
SED-100RJ1-C Fully-Automatic Softgel Encapsulation Machine and production line - GMP-grade rotary-die encapsulator with Siemens PLC + Siemens/ABB control, all parts machined on Swiss-made high-precision CNC. Die-roll mai
مبدأ العمل
Two gelatin films are formed on left/right gelatin rollers - gelatin liquid from the heated gelatin box coats onto the rotating roller and is chilled by a circulating water-cooling system. Films pass through the oil-roller system(liquid paraffin lubrication), then meet between the left/right rotary dies driven by an AC inverter(0-4rpm in manual / 0-5rpm spec). The 6-plunger feeding pump(volume 0-1.5mL each, continuously adjustable) injects fill via the new rectangular direct-injection wedge - heated by heating tube and PID temperature sensor - into each die cavity as the films seal and cut. A pill ejector below the head drops finished capsules onto an inclined chute and stainless conveyor feeding the multi-section stainless tumble dryer; forward rotation tumbles capsules for shape setting, reverse rotation discharges them. A ground-based three-layer gelatin tank supplies gelatin via air-pressurised silicone hose with heating jacket. Operator controls via Siemens HMI touchscreen(bilingual Chinese/English).
المواصفات الفنية
المواصفات
الأبعاد
المواد
الخصائص الرئيسية
التطبيقات
القطاعات
الامتثال
التنظيف والصيانة
Each shift: top up liquid paraffin in body, feeding pump and hopper-side oil tanks. Weekly: replace liquid paraffin in body and feed pump and clean the filter; remove and clean pill ejector. Always keep both rubber wheels clean and oil-free. Immediately clean gelatin box and gelatin hose when stopping production. Check main drive belt + conveyor belt tension each shift. Periodically clean dryer fan-cover air inlet. Annually: dismantle, inspect and clean all mechanical equipment. Check insulation resistance(>=5MOhm) and grounding regularly.
