SED-250ZKX-S — Vacuum Drying Oven

Samples are placed in a sealed 304 SS chamber and the chamber is evacuated by a separately purchased pump to ≤100 Pa. Reduced pressure dramatically lowers the boiling point of solvents, allowing low-temperature drying of heat-sensitive materials without oxidation or air-flow disturbance. A proprietary sleeve-type heating element wrapped around the chamber transfers heat uniformly through conduction and natural convection while moisture vapor is continuously pumped out. The PID controller with embedded temperature sensor maintains ≤±0.3°C fluctuation. Auto parameter save-on-power-interruption and power-recovery resume prevent data loss.