SED-550-350XSJ-A

Card is placed on the lower platen; the blister/product combination is positioned on the card by the mould. The upper platen(30 mm thick heating plate) is driven downward by dualΦ125 mm Airtac cylinders(four guide pillars maintain parallelism). Heat from the heating plate transfers through the mould and thermally bonds the blister-edge coating to the card(temperature controller ±1°C). Oil-water separator removes moisture from compressed air to protect the pneumatic system. The 300 mm thick lower platen prevents deformation at elevated temperature, ensuring flat, even sealing.